Facilities
Highlights
Electron Beam Lithography
- JEOL JBX-6000FS Electron Beam Lithography System
- Leica/Cambridge EBMF 10.5 Electron Beam Lithography System
- Cambridge E-Beam Lithography Job Request Form
Optical Lithography
- Anvik Large-Area Lithography System
- GCA DSW-6100 G-Line Series Wafer Stepper
- Karl Suss MJB3 Contact Mask Aligners
- Quintel Q7000 IR Backside Mask Aligner
- YES HMDS Vapor Prime Vacuum Oven
- Fusion Flood Exposure System
- Fusion Deep-UV Photostabilizer
- Olympus, Nikon Inspection Microscopes
- Olympus Inspection Microscope w/Video Camera & Monitor
- Wet Bench w/Digital Hotplates
- Bake Ovens
- Solitec Spinner
- Headway Spinner
Scanning Electron Microscopy
- Hitachi S-4500 Field Emission Scanning Electron Microscope
- Hitachi S-4800 Field Emission Scanning Electron Microscope
- Leo (Leica/Cambridge) S360 Scanning Electron Microscope
Etching
- STS Advanced Silicon Etcher
- PlasmaLab Dual-Chamber Reactive Ion Etcher
- PlasmaTherm SLR-770 Inductively Coupled Plasma Reactive Ion Etcher
- PlasmaTherm Oxygen Reactive Ion Etcher (polymer etch)
- PlasmaLab Freon/O2 Reactive Ion Etch (RIE) System
- Planar Plasma Etch System (Descum/Ash)
- Idonus HF Vapor Etch System
- XACTIX XeF2 etching system
Evaporation / Sputtering Deposition
- CHA SEC-600 E-Beam/Thermal Evaporator
- Cooke E-Beam/Thermal Evaporator
- Cooke Dual-Gun Sputter System
- Denton Optical Coater
- Edwards Auto 306 Thermal Evaporator
- Lesker Sputter System
- SPI Au Sputter Coater for SEM Sample Prep
- Hummer Al Sputter Coater
Click here for a list of evaporator supplies
Chemical Vapor Deposition
- Atomate Carbon Nanotube CVD Growth System
- Cambridge NanoTech Atomic Layer Deposition System
- STS Mixed-Frequency Nitride PECVD System
- PlasmaLab Plasma-Enhanced Chemical Vapor Deposition System
- ASM America Low-Pressure Chemical Vapor Deposition System
- SCS Parylene Deposition System
E-Beam Chemistry
General Chemistry
Diffusion/Oxidation/Anneal
- Lindberg/Tempress Model 8500 Dual-Stack Diffusion/Oxidation Furnaces
- Jipelec Rapid Thermal Processor (RTP)
- Verteq Wafer Rinser/Dryer
Characterization and Analysis
- FEI Model 611 Focused Ion Beam System
- Rudolph FE-III Focus Ellipsometer
- Digital Instruments Dimension 3000 Atomic Force Microscope
- Tencor Alpha-Step 200 Profilometers
- Veeco NT1000 Optical Profiler
- Alcatel ASM 142 He Leak Detector
- Nikon Inspection Microscope w/Digital Camera & Monitor
- FSM Film Stress Measurement System
- Asylum AFM
Packaging
- Hybond Model 572 Thermosonic Wedge Bonder
- Westbond Thermosonic Ball Bonder
- Disco DAD-6TM Wafer Dicing Saw
Contact Information:
Additional information can be obtained from the tool's super user (list here). For further tool information or to inquire about using the UIUC Micro and Nanotechnology Laboratory, please contact John Hughes using the telephone number or e-mail address below:
Micro and Nanotechnology Laboratory
University of Illinois at Urbana-Champaign
208 North Wright Street
Urbana, IL 61801
Phone: (217) 333-4674
Fax: (217) 244-6375
E-Mail: hughes@uiuc.edu